In the aerospace, semiconductor and high-end electronics sectors, release film is a critical auxiliary material that directly determines product yield, reliability and surface performance. As manufacturing processes evolve toward higher precision, higher pressure and extreme temperature conditions, conventional film materials can no longer meet the requirements of these complex application scenarios. Leveraging the atomic-level structural advantages of fluoropolymers, the VitaFlon® MR Series Release Film (including ETFE, FEP, PFA, PTFE and other grades) from Zhengyu New Materials is emerging as a core driver for high-end domestic substitution of release films in China.
1. Aerospace: Conformability and Zero Contamination in Extreme Environments
During the vacuum forming of carbon fiber composite parts, conventional films are prone to bridging, which causes uneven stress distribution, and tend to outgas small molecules at high temperatures that contaminate the prepreg.
Superior Vacuum Conformability: VitaFlon® ETFE features an ultra-high elongation at break of 300%-500%. It conforms to complex curved surfaces such as wing leading edges and S-shaped air inlets like a "second skin", completely eliminating wrinkles.
Aerospace-Grade Low Outgassing: It delivers an extremely low Total Mass Loss (TML) in high-temperature vacuum environments, eliminating the migration of volatile condensables into the resin matrix at the source and safeguarding the fundamental mechanical properties of composites.
2. Semiconductor Packaging: Dimensional Stability and Clean Release
In advanced packaging processes, temperatures above 180°C can easily cause film deformation and lead to chip tunneling defects, while the tensile force during demolding poses a high risk of damaging low-k dielectric layers.
High-Temperature Rigid Support: It maintains exceptional dimensional accuracy under packaging process temperatures, acting as a "rigid temporary mold skin" to precisely lock the chip position and fully eliminate flash defects.
Nanoscale Lawn-Effect Release: It leverages its inherent low surface energy to achieve drag-free demolding, enabling residue-free, stress-free release between dense solder balls and micro-circuits, and significantly improving product yield.
3. High-End Electronics: Performance Backing for Flexible and Ultra-High-Frequency Applications
For flexible printed circuit (FPC) lamination and high-frequency copper clad laminate (CCL) manufacturing, release films must withstand multiple process cycles without interfering with the dielectric properties of the end product.
Exceptional Electrical Isolation: It has an ultra-low dielectric constant (Dk) and dissipation factor (Df), introducing no additional interfering factors and supporting stable transmission of 5G/6G high-frequency signals.
Voltage Resistance and Anti-Blocking Performance: With outstanding chemical resistance and long-lasting release properties, it ensures no blocking or residue after repeated lamination cycles, effectively reducing production costs.
Conclusion
Release films have evolved from ordinary consumables into strategic industrial materials. Backed by internationally authoritative management system certifications including AS9100, Zhengyu New Materials is accelerating the delivery of reliable domestic substitution solutions in critical sectors such as aerospace and semiconductors.
